Ethoxylated Bisphenol A Dimethacrylate

Purity 98%: Ethoxylated Bisphenol A Dimethacrylate with 98% purity is used in UV-curable coatings, where it enhances surface hardness and chemical resistance.Viscosity 400 mPa·s: Ethoxylated Bisphenol A Dimethacrylate of 400 mPa·s viscosity is used in 3D printing resins, where it improves layer adhesion and dimensional accuracy.Molecular Weight 600 g/mol: Ethoxylated Bisphenol A Dimethacrylate with a molecular weight of 600 g/mol is used in dental composites, where it optimizes the polymer network formation and reduces shrinkage.Melting Point -10°C: Ethoxylated Bisphenol A Dimethacrylate with a melting point of -10°C is used in adhesives, where it ensures easy handling and uniform mixing at low temperatures.Stability Temperature 180°C: Ethoxylated Bisphenol A Dimethacrylate with 180°C stability temperature is applied in high-performance laminates, where it delivers thermal stability and long-term durability.Hydroxyl Value 20 mg KOH/g: Ethoxylated Bisphenol A Dimethacrylate with a hydroxyl value of 20 mg KOH/g is used in functional inks, where it enables crosslinking and increases print abrasion resistance.Viscosity 600 mPa·s: Ethoxylated Bisphenol A Dimethacrylate at 600 mPa·s viscosity is used in fiber-reinforced composites, where it improves resin wet-out and mechanical strength.