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HS Code |
762461 |
| Chemicalname | Bis(3-Allyl-4-Hydroxyphenyl)Sulfone |
| Casnumber | 1989-84-8 |
| Molecularformula | C18H18O4S |
| Molecularweight | 330.40 g/mol |
| Appearance | White to off-white powder |
| Meltingpoint | 209-212°C |
| Solubility | Insoluble in water, soluble in organic solvents |
| Purity | Typically ≥98% |
| Storagetemperature | Room temperature, tightly sealed |
| Synonyms | BPS, 4,4'-Sulfonylbis(2-allylphenol) |
As an accredited Bis(3-Allyl-4-Hydroxyphenyl)Sulfone factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | 500g of Bis(3-Allyl-4-Hydroxyphenyl)Sulfone, securely sealed in an amber glass bottle with tamper-evident cap, labeled for laboratory use. |
| Shipping | Bis(3-Allyl-4-Hydroxyphenyl)Sulfone should be shipped in tightly sealed, chemical-resistant containers, protected from moisture and direct sunlight. The package must be clearly labeled according to regulatory standards, and accompanied by appropriate Material Safety Data Sheets (MSDS). Transport should comply with all applicable local, national, and international chemical shipping regulations. |
| Storage | Bis(3-Allyl-4-Hydroxyphenyl)Sulfone should be stored in a tightly sealed container, in a cool, dry, and well-ventilated area away from direct sunlight and sources of heat or ignition. It should be kept away from incompatible substances such as strong acids and oxidizing agents. Use appropriate personal protective equipment when handling, and clearly label the storage container. |
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Purity 99%: Bis(3-Allyl-4-Hydroxyphenyl)Sulfone with 99% purity is used in high-performance polymer synthesis, where it ensures superior polymer chain uniformity. Melting Point 210°C: Bis(3-Allyl-4-Hydroxyphenyl)Sulfone with a melting point of 210°C is used in heat-resistant coatings, where it provides enhanced thermal stability. Molecular Weight 362.44 g/mol: Bis(3-Allyl-4-Hydroxyphenyl)Sulfone with a molecular weight of 362.44 g/mol is used in specialty resin manufacturing, where it imparts optimal mechanical strength. Particle Size <10 µm: Bis(3-Allyl-4-Hydroxyphenyl)Sulfone with particle size below 10 µm is used in advanced composites, where it enables uniform dispersion and improved composite integrity. Viscosity Grade Medium: Bis(3-Allyl-4-Hydroxyphenyl)Sulfone with medium viscosity grade is used in adhesive formulations, where it enhances bond formation and processability. Stability Temperature 280°C: Bis(3-Allyl-4-Hydroxyphenyl)Sulfone with a stability temperature of 280°C is used in electrical insulation compounds, where it maintains dielectric properties under elevated temperatures. Solubility in DMF: Bis(3-Allyl-4-Hydroxyphenyl)Sulfone with high solubility in DMF is used in solution processing applications, where it promotes efficient processing and film formation. Ash Content <0.05%: Bis(3-Allyl-4-Hydroxyphenyl)Sulfone with ash content less than 0.05% is used in precision optical components, where it minimizes impurities affecting optical clarity. Hydroxyl Content 8-10%: Bis(3-Allyl-4-Hydroxyphenyl)Sulfone with hydroxyl content of 8-10% is used in crosslinking agents, where it improves reactivity and network strength. Volatile Matter <0.2%: Bis(3-Allyl-4-Hydroxyphenyl)Sulfone with volatile matter under 0.2% is used in high-purity electronic encapsulants, where it ensures stable encapsulation and low outgassing. |
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