P.R.8

Purity 99%: P.R.8 with purity 99% is used in high-precision semiconductor manufacturing, where it ensures minimal contamination and reliable device performance. Molecular weight 250 g/mol: P.R.8 with molecular weight 250 g/mol is used in polymer synthesis, where it enables consistent chain growth and uniform polymer structure. Viscosity grade 120 cP: P.R.8 with viscosity grade 120 cP is used in lubricant formulations, where it provides optimal film strength and reduces mechanical wear. Particle size 5 µm: P.R.8 with particle size 5 µm is used in advanced coating applications, where it promotes smooth surface finish and enhanced abrasion resistance. Melting point 210°C: P.R.8 with melting point 210°C is used in thermal molding processes, where it maintains structural integrity at elevated temperatures. Stability temperature 180°C: P.R.8 with stability temperature 180°C is used in heat-resistant adhesive production, where it preserves bonding strength under prolonged thermal stress. Water solubility 0.02 g/L: P.R.8 with water solubility 0.02 g/L is used in hydrophobic treatment formulations, where it achieves durable moisture barriers in construction materials. Flash point 150°C: P.R.8 with flash point 150°C is used in industrial cleaning agents, where it reduces flammability risks during solvent processing. Refractive index 1.460: P.R.8 with refractive index 1.460 is used in optical component manufacturing, where it enhances light transmission and minimizes distortion. Bulk density 0.85 g/cm³: P.R.8 with bulk density 0.85 g/cm³ is used in powder metallurgy, where it assists in achieving precise compaction and uniform green strength.