|
HS Code |
204566 |
| Product Name | Durez 33553 Phenolic Resin |
| Manufacturer | Durez Corporation |
| Resin Type | Phenolic |
| Appearance | Powder |
| Color | Brown |
| Cure Time | Fast cure |
| Softening Point | 86°C |
| Free Phenol Content | 0.5% max |
| Flow | 35 mm |
| Moisture Content | 0.5% max |
| Specific Gravity | 1.23 |
| Recommended Application | Compression and transfer molding |
| Storage Stability | 6 months at 25°C |
As an accredited Durez 33553 Phenolic Resin factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Durez 33553 Phenolic Resin is typically packaged in 25 kg (55 lb) multi-ply paper bags with moisture-resistant liners for protection. |
| Container Loading (20′ FCL) | 20′ FCL container loading involves shipping Durez 33553 Phenolic Resin in bulk, optimizing space for cost-efficient and secure international transport. |
| Shipping | Durez 33553 Phenolic Resin should be shipped in tightly sealed, clearly labeled containers, protected from moisture, heat, and direct sunlight. Handle as a combustible solid; avoid rough handling. Transport per relevant DOT/IMDG/ICAO/IATA regulations for resins. Ensure compatibility with other cargo and provide appropriate documentation, including safety data sheets. |
| Storage | Durez 33553 Phenolic Resin should be stored in a cool, dry, and well-ventilated area, away from sources of heat, ignition, and direct sunlight. Keep containers tightly closed to prevent moisture absorption and contamination. Store in original packaging or approved containers, and avoid contact with strong oxidizers and acids. Regularly inspect storage areas for any signs of resin degradation or leakage. |
| Shelf Life | Durez 33553 Phenolic Resin typically has a shelf life of 12 months when stored unopened in a cool, dry environment. |
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Viscosity grade: Durez 33553 Phenolic Resin with medium viscosity grade is used in automotive brake pads manufacturing, where it ensures optimal friction stability and consistent braking performance. Purity: Durez 33553 Phenolic Resin with 98% purity is used in electrical laminates production, where it provides high dielectric strength and reduced electrical conductivity. Melting point: Durez 33553 Phenolic Resin featuring a melting point of 105°C is used in compression molding, where it allows precise shape formation and dimensional accuracy. Particle size: Durez 33553 Phenolic Resin with controlled particle size distribution is used in friction material compounding, where it enables uniform dispersion and improved mechanical integrity. Thermal stability: Durez 33553 Phenolic Resin with high thermal stability up to 250°C is used in heat shield components, where it maintains structural integrity under extreme temperatures. Water absorption: Durez 33553 Phenolic Resin with low water absorption is used in circuit board substrates, where it enhances moisture resistance and extends component lifespan. Glass transition temperature: Durez 33553 Phenolic Resin with a glass transition temperature of 120°C is used in structural adhesives, where it improves bond strength and creep resistance. Molecular weight: Durez 33553 Phenolic Resin with a molecular weight of 12,000 g/mol is used in abrasive wheel bonding, where it delivers enhanced toughness and reduced brittleness. Ash content: Durez 33553 Phenolic Resin with less than 1% ash content is used in high-precision molding, where it ensures minimal residue and superior surface finish. Flow properties: Durez 33553 Phenolic Resin with controlled flow properties is used in electrical insulation components, where it allows for intricate molding and improved dimensional stability. |
Competitive Durez 33553 Phenolic Resin prices that fit your budget—flexible terms and customized quotes for every order.
For samples, pricing, or more information, please contact us at +8615651039172 or mail to sales9@bouling-chem.com.
We will respond to you as soon as possible.
Tel: +8615651039172
Email: sales9@bouling-chem.com
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