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HS Code |
336658 |
| Product Name | Durez 33771 Phenolic Resin |
| Type | Phenol-formaldehyde resin |
| Appearance | Free-flowing powder |
| Color | Brown |
| Molecular Weight | High molecular weight |
| Softening Point | 85-95°C |
| Ash Content | ≤2.5% |
| Moisture Content | ≤1.0% |
| Volatile Content | ≤5.0% |
| Cure Temperature | 150-175°C |
| Flow | 38 mm (at specified test conditions) |
| Specific Gravity | 1.25-1.35 |
| Storage Stability | 6 months at 25°C |
| Solubility | Partially soluble in alcohols and acetone |
| Application | Molding compounds, friction materials, adhesives |
As an accredited Durez 33771 Phenolic Resin factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Durez 33771 Phenolic Resin is typically packaged in 25 kg (55 lb) multi-ply paper bags with a polyethylene liner for protection. |
| Container Loading (20′ FCL) | Container Loading (20′ FCL): Approximately 18 metric tons of Durez 33771 Phenolic Resin packed in 20-kg bags, palletized and shrink-wrapped. |
| Shipping | Durez 33771 Phenolic Resin should be shipped in tightly sealed, labeled containers, protected from moisture and direct sunlight. Transport under cool, dry conditions, complying with local, state, and international regulations. Ensure containers remain upright, secure during transit, and accompanied by relevant Safety Data Sheet (SDS) documentation for proper handling and emergency response. |
| Storage | Durez 33771 Phenolic Resin should be stored in a cool, dry, and well-ventilated area, away from sources of ignition and direct sunlight. Keep containers tightly closed to prevent moisture absorption and contamination. Store away from strong oxidizing agents or acids. Ensure the storage area’s temperature does not exceed recommended limits, and follow all local regulations for fire safety and chemical storage. |
| Shelf Life | The shelf life of Durez 33771 Phenolic Resin is typically 12 months when stored in a cool, dry, and sealed container. |
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Purity 99%: Durez 33771 Phenolic Resin with a purity of 99% is used in electrical laminates, where high dielectric strength and insulation reliability are achieved. Viscosity grade 5000 cP: Durez 33771 Phenolic Resin with a viscosity grade of 5000 cP is used in friction material manufacturing, where improved processability and uniform distribution of fillers are realized. Melting point 85°C: Durez 33771 Phenolic Resin with a melting point of 85°C is used in molded automotive components, where enhanced flow properties and dimensional accuracy are obtained. Particle size <75 μm: Durez 33771 Phenolic Resin with particle size below 75 μm is used in powder coating applications, where superior surface finish and consistent film thickness are ensured. Stability temperature 180°C: Durez 33771 Phenolic Resin with a stability temperature of 180°C is used in brake pad production, where thermal resistance and performance retention are maximized. Molecular weight 2300 g/mol: Durez 33771 Phenolic Resin with a molecular weight of 2300 g/mol is used in composite panels, where mechanical strength and structural integrity are improved. Free phenol content <1%: Durez 33771 Phenolic Resin with free phenol content below 1% is used in electronic encapsulation, where minimized outgassing and material purity are critical. Moisture content <0.5%: Durez 33771 Phenolic Resin with a moisture content below 0.5% is used in insulation boards, where dimensional stability and reduced warpage are maintained. |
Competitive Durez 33771 Phenolic Resin prices that fit your budget—flexible terms and customized quotes for every order.
For samples, pricing, or more information, please contact us at +8615651039172 or mail to sales9@bouling-chem.com.
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Tel: +8615651039172
Email: sales9@bouling-chem.com
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