|
HS Code |
230044 |
| Productname | Polyamide Resin DT610 |
| Appearance | Light yellow transparent solid |
| Softeningpoint | 106-116°C |
| Acidvalue | 6 mg KOH/g max |
| Aminevalue | 8 mg KOH/g max |
| Colorgardner | 7 max |
| Viscosity25c | 250-350 mPa.s (50% resin in xylene) |
| Density | 0.98-1.01 g/cm³ |
| Solubility | Soluble in aromatic hydrocarbons and esters, insoluble in water |
| Compatibility | Compatible with nitrocellulose, alkyd resin, and epoxy resin |
| Recommendeduse | Gravure and flexographic inks, hot melt adhesives |
As an accredited Polyamide Resin DT610 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | The Polyamide Resin DT610 is packaged in 25 kg net weight, multi-layer kraft paper bags with an inner plastic lining for protection. |
| Container Loading (20′ FCL) | 20′ FCL can load around 12–14 metric tons of Polyamide Resin DT610, packed in 25kg bags on pallets for safe transport. |
| Shipping | Polyamide Resin DT610 is typically shipped in 25 kg bags, kraft paper sacks, or fiber drums, ensuring protection from moisture and contamination. Containers should be sealed and stored in a cool, dry place. Handle with care during transport to avoid physical damage. Follow applicable regulations for chemical shipment and labeling. |
| Storage | Polyamide Resin DT610 should be stored in a cool, dry, and well-ventilated area, away from direct sunlight, heat sources, and moisture. Keep the container tightly sealed to prevent contamination and deterioration. Avoid exposure to strong acids, bases, and oxidizing agents. Recommended storage temperature is below 30°C. Always follow manufacturer’s guidelines and local regulations for safe storage and handling. |
| Shelf Life | Polyamide Resin DT610 has a shelf life of 12 months when stored in a cool, dry, and well-ventilated area. |
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Purity 98%: Polyamide Resin DT610 with a purity of 98% is used in gravure ink formulations, where it enhances color clarity and reduces impurities. Molecular Weight 7,500 g/mol: Polyamide Resin DT610 of 7,500 g/mol is used in flexographic printing, where it improves print sharpness and adhesion. Melting Point 130°C: Polyamide Resin DT610 with a melting point of 130°C is used in hot melt adhesives, where it provides rapid setting and high thermal resistance. Viscosity Grade 80-120 cps: Polyamide Resin DT610 with viscosity grade 80-120 cps is used in surface coatings, where it enables smooth application and minimal surface defects. Acid Value 10 mg KOH/g: Polyamide Resin DT610 with an acid value of 10 mg KOH/g is used in protective coatings, where it promotes chemical resistance and durability. Stability Temperature 180°C: Polyamide Resin DT610 with stability temperature of 180°C is used in heat-seal lacquers, where it maintains structural integrity under high-temperature processing. Particle Size 25 μm: Polyamide Resin DT610 with particle size of 25 μm is used in pigment dispersions, where it supports uniform distribution and optimal color development. |
Competitive Polyamide Resin DT610 prices that fit your budget—flexible terms and customized quotes for every order.
For samples, pricing, or more information, please contact us at +8615651039172 or mail to sales9@bouling-chem.com.
We will respond to you as soon as possible.
Tel: +8615651039172
Email: sales9@bouling-chem.com
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