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HS Code |
750882 |
| Product Name | SFC-112/65 1 Phenolic Resin |
| Appearance | Clear to yellowish liquid |
| Solid Content | 65% |
| Viscosity At 25c | 150-350 mPa.s |
| Free Phenol Content | <0.5% |
| Specific Gravity At 25c | 1.18-1.22 |
| Solvent | Ethanol |
| Flash Point | 23°C |
| Storage Stability | 12 months at 25°C (unopened) |
| Application | Abrasives bonding |
| Curing Temperature | 120-180°C |
As an accredited SFC-112/65 1 Phenolic Resin factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | SFC-112/65 1 Phenolic Resin is packaged in a 200 kg steel drum with secure sealing, ensuring safe handling and storage. |
| Container Loading (20′ FCL) | Container Loading (20′ FCL) for SFC-112/65 1 Phenolic Resin: 16 metric tons packed in 640 steel drums per container. |
| Shipping | The shipping of SFC-112/65 1 Phenolic Resin involves secure packaging in lined steel drums or approved containers to prevent leaks and contamination. All containers are clearly labeled with hazard information in compliance with relevant transport regulations. The resin is typically shipped via road or sea, following standard chemical handling protocols. |
| Storage | The chemical **SFC-112/65 1 Phenolic Resin** should be stored in a cool, dry, and well-ventilated area away from ignition sources and direct sunlight. Keep the container tightly closed to prevent moisture absorption and contamination. Avoid storage near oxidizing agents and acids. Ensure proper labeling and follow all safety data sheet (SDS) recommendations for safe handling and storage. |
| Shelf Life | SFC-112/65 1 Phenolic Resin typically has a shelf life of 6-12 months when stored in sealed containers at cool, dry conditions. |
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Purity 98%: SFC-112/65 1 Phenolic Resin with purity 98% is used in brake pad formulations, where it improves thermal stability and reduces wear rate. Viscosity grade 800 cps: SFC-112/65 1 Phenolic Resin of viscosity grade 800 cps is used in laminates manufacturing, where it ensures uniform resin flow and strong adhesion. Molecular weight 750 Da: SFC-112/65 1 Phenolic Resin with a molecular weight of 750 Da is used in friction material production, where it delivers enhanced mechanical strength. Melting point 85°C: SFC-112/65 1 Phenolic Resin at a melting point of 85°C is used in molding compounds, where it allows efficient processing and consistent cure time. Particle size 20 microns: SFC-112/65 1 Phenolic Resin with a particle size of 20 microns is used in adhesive systems, where it promotes smooth dispersion and uniform bonding. Storage stability 12 months: SFC-112/65 1 Phenolic Resin with storage stability of 12 months is used in composite panel manufacture, where it ensures prolonged shelf life and reliability. Free formaldehyde <0.3%: SFC-112/65 1 Phenolic Resin with free formaldehyde content less than 0.3% is used in insulation foam applications, where it minimizes emissions and enhances workplace safety. Thermal decomposition temperature 280°C: SFC-112/65 1 Phenolic Resin featuring a thermal decomposition temperature of 280°C is used in foundry sand binders, where it imparts high-temperature resistance and dimensional accuracy. |
Competitive SFC-112/65 1 Phenolic Resin prices that fit your budget—flexible terms and customized quotes for every order.
For samples, pricing, or more information, please contact us at +8615651039172 or mail to sales9@bouling-chem.com.
We will respond to you as soon as possible.
Tel: +8615651039172
Email: sales9@bouling-chem.com
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